Researchers used advanced electron ptychography to visualize atomic-scale defects inside modern transistors. The technique ...
The Capital Region has become an epicenter for research and manufacturing of so-called 3D, or stackable, computer chips, a ...
Researchers at Cornell University have developed a powerful imaging technique that reveals atomic scale defects inside computer chips for the first time. Using an advanced electron microscopy method, ...
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This new 3D chip could smash AI’s biggest bottleneck
Artificial intelligence has raced ahead so quickly that its biggest constraint is no longer clever algorithms but the plumbing that feeds them data. A new generation of 3D chips, built by stacking ...
Cornell researchers have used advanced electron microscopy to identify "mouse bite" defects in 3D transistors for the first time ...
Funding from the U.S. National Science Foundation is part of a broader push to propel domestic computer chip manufacturing A $3 million grant from the U.S. National Science Foundation (NSF) to the ...
A new power supply technology for 3D-integrated chips has been developed using a vertically stacked architecture, where processing units are positioned directly above dynamic random access memory ...
Artificial intelligence computing startup D-Matrix Corp. said today it has developed a new implementation of 3D dynamic random-access memory technology that promises to accelerate inference workloads ...
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