The Intel 18A process is in production and features a critical technology currently exclusive to Intel. Backside power delivery moves power circuits to the back of the chip, unlocking additional ...

As the semiconductor industry moves to smaller scales, it must overcome several technical challenges. In 2025, we expect three key developments to make headlines: Gate-All-Around transistor designs, ...

The problem: As metal pitch scaling shrinks to support the next generation of logic devices, the IR (or voltage) drop from conventional frontside connections has become a major challenge [1,2]. As ...

Delve into the details of vertical power delivery and how it surmounts the limits of traditional lateral power when it comes to supporting secondary power rails. Why traditional lateral power delivery ...