The move to multi-die packaging is driving chipmakers to develop more cost-effective ways to ensure only known-good die are integrated into packages, because the price of failure is significantly ...

The back-end semiconductor manufacturing process refers to the IC packaging and testing that people often hear about. Specifically, the process known as chip probing (CP) is conducted to test the ...

The number and variety of test interfaces, coupled with increased packaging complexity, are adding a slew of new challenges.

Air leak testing is a critical quality control process in the die casting industry to identify defects in castings such as porosity, cracks, and leaks A proper training, equipment, and maintenance is ...

Sept 26 (Reuters) - Siemens Digital Industries Software, a unit of Siemens AG (SIEGn.DE), opens new tab, on Monday said it launched new software called Tessent Multi-die that automates a design ...