Every modern wireless device is expected to be fast, intelligent, power-efficient and always connected. When engineers seek reliable ways to deliver that intelligence without adding unnecessary ...

Embedding chips into stacked-die assemblies is creating thermal dissipation challenges that can reduce the reliability and lifespan of these devices, a growing problem as chipmakers begin cramming ...

If real-world demonstrations are any indication, multifunction 3G (third-generation) wireless devices may not be such a pipe dream after all. Although Sun Microsystems Inc. has used the JavaOne show ...

Embedded systems power everything from smart agriculture sensors to life-saving medical implants. As their numbers swell into the tens of billions, the engineering community faces a pivotal challenge: ...