As part of writing tech stories such as those we feature here at Hackaday, there is a huge amount of research to be done. We trawl through pages and pages of obscure blogs, videos, and data sheets.

With the incessant down-scaling of electronics, traditional semiconductors like Si are encountered with insurmountable hurdles to maintain performance increase without bringing about additional issues ...

A new technical paper titled “Design-for-Test Solutions for 3D Integrated Circuits” was published by researchers at Duke University, Arizona State University, and NVIDIA. “As Moore’s Law approaches ...

This document gives information on the thermal design of integrated circuits in plastic packages. It provides some factors that the designer should consider before the necessary heat sinking can be ...