Heat dissipation is a critical issue for designers of complex chip-stacking and system-in-package devices. The amount of heat generated by a device increases as the number of transistors goes up, but ...

Subramanian Iyer, distinguished chancellor’s professor in UCLA’s Electrical Engineering Department—and a former fellow and director of the systems scaling technology department at IBM—sat down with ...

Assessing potential opportunities and threats—as well as strengths and weaknesses—can help medical packaging engineers make more strategic decisions. By Abhishek Gautam It is a common decision-making ...

Siemens new CPU 1518 ODK advanced controller and Simatic ODK 1500S engineering package streamline the configuration and functionality of high-level language programs, including C/CC++. Jan. 6, 2017 ...