MasterSil 151 is a two-component, low-viscosity silicone compound for high-performance casting, potting, and encapsulation applications. This material features an operating temperature range of –65° ...

In a recent case study, CSignum, a specialist in subsea wireless communication, turned to Intertronics when developing the EM ...

Toughened epoxy system EP21FL has a 4 to 1 mix ratio by weight and cures at ambient temperature. It has a low mixed viscosity of 2,000-4,500 cps. EP21FL has excellent electrical insulation properties ...

Polyurethane is projected to hold a significant market share during the forecast period. The stationary charging setup is projected to hold the largest share during the forecast period. North America ...

Depending on the application’s needs there are numerous potting compounds available, with formulations offering properties including being low density/lightweight, flame retardant, flexible, optically ...

The EP30FL flexible epoxy potting and encapsulation compound suits environments exposed to thermal cycling, and withstands mechanical shock and vibration. The material provides a low viscosity and is ...

Master Bond MasterSil 152, a two-component condensation curing system, was created for potting and encapsulation applications where it is not possible to use an addition-cured silicone. The system ...

DELRAY BEACH, Fla., Feb. 6, 2026 /PRNewswire/ -- According to MarketsandMarkets, the Electronic Potting Compound Market is projected to grow from USD 0.36 billion in 2025 and to reach USD 0.96 billion ...