A new process design kit (PDK) from imec aims to provide broad access to a 2-nm gate-all-around (GAA) process node and associated backside connectivity for design pathfinding, system research, and ...
EV charging veteran ChargePoint has unveiled its new charger product architecture, which is described as a “generational leap in AC Level 2 charging.” The new ChargePoint technology designed for ...
Apple Inc.’s upcoming M5 line of Mac chips will be made using Taiwan Semiconductor Manufacturing Co.’s three-nanometer N3P process, 9to5Mac reported today. The publication attributed the information ...
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