CAMBRIDGE, UK — Zuken launched version 12 of its PCB layout, placement and routing solution CR-5000 Board Designer. The new version has been developed with enhanced editing functionality, ...

The OMAP3530 CUS package is designed with a new technology called Via Channel™ array. This technology allows for easy routing of the device in two signal and two power layers using standard 20 mil ...

6. SOT-23 and SOIC packages are typically used in low-power motor drivers. Standard leaded packages, like SOIC and SOT-23 packages, are often used for low-power motor drivers (Fig. 6). To maximize the ...

With the significant reduction in package parasitics provided by the eGaN FET, the package inductance is minimized and is no longer the major parasitic loss contributor. The high frequency loop ...