Device test times also are rising dramatically. Longer test times are driven by higher levels of embedded memory, higher functionality, higher quality requirements, and the need to move more tests to ...

The variety of different test methodologies combined with today�s mixture of memory devices creates a complex test profile. The manufacturing test floor hums with activity; a range of memory devices ...

SANTA CLARA, Calif.–Looking to reduce the soaring costs of IC test, Intel Corp. hopes to leverage its “casual learning algorithm” technology for wafer sort applications in the fab. Intel is looking to ...

Test is a dirty business. It can contaminate a unit or wafer, or the test hardware, which in turn can cause problems in the field. While this has not gone unnoticed, particularly as costs rise due to ...

Single die packages and products have been the norm for decades. Moreover, so has multi-chip modules (MCMs) or system in package (SiP) for quite some time. Understandably, with ASICs and SoCs becoming ...