Abstract: This work reports a monolithic RF front-end module integrating bulk acoustic wave (BAW) filters, Lamb acoustic wave filters, and electronic RF silicon-on-insulator (RFSOI) switches to ...
Abstract: We have investigated the impact of die thickness on integrated passive device (IPD) performance both in simulation and from measurement for RF stack-die applications. Our simulation approach ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results